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specification part no. : MT4P060-WR-A high power led observe precaution for handling electro static sensitive devices attention 3northway lane north latham,new york 12110. tollfree:1.800.984.5337 phone:1.518.956.2980 fax:1.518.785.4725 http://www.marktechopto.com
ver.: 01 date: 2009/05/12 page: 1/4 package dimensions 7.620.5 7.620.5 + + + + 5.08 ? 0.3 2.5 2.5 5.0 2 1 3 4 1 2 3 4 l l 5.08 ? 0.3 0.4 ? 0.2 1.20.1 4.90.2 2.4 +0.4 -0.2 notes: 1. all dimensions are in mm. 2. tolerance is 0.25mm unless otherwise noted. description led chip part no. material emitting color lens color mtp00-w- high power led MT4P060-WR-A ingan/sapphire warm white water clear
ver.: 01 date: 2009/05/12 page: 2/4 absolute maximum ratings at ta=25
parameter symbol rating unit power dissipation o p d 108 mw reverse voltage o v r 5 v d.c. forward current o if 30 ma peak current(1/10duty cycle,0.1ms pulse width.) o if(peak) 100 ma operating temperature range topr. -40 to +100
storage temperature range tstg. -40 to +100
soldering temperature (1.6mm from body) tsld. dip soldering: 260 for 5 sec.
hand soldering: 350 for 3 sec.
electric static discharge threshold (hbm) o esd 6000 v o the value are based on 1 die performance. electrical and optical characteristics: parameter symbol condition min. typ. max. unit luminous flux o2 v if=20ma o 1 9.0 10.0 lm forward voltage o1 vf if=20ma o 1 3.2 3.6 v 32 3200 - 3300 33 3300 - 3400 34 3400 - 3500 35 3500 - 3600 36 3600 - 3700 correlated colour temperature o2 37 cct if=20ma o 1 3700 - 3800 o k reverse current o1 ir vr=5v o1 50 a cct: 3200-3500 68 color rendering index (ra) cct: 3500-3800 cri if=20ma o 1 72 viewing angle o 2 21/2 if=20ma o 1 60 deg notes: 1.the datas tested by is tester. 2. customers sp ecial requirements are also welcome. 3. o 1 for each die 4. o 2 when all led dies are operated simultaneously.. MT4P060-WR-A high power led
ver.: 01 date: 2009/05/12 page: 3/4 typical electrical/optical characteristic curves (25
ambient temperature unless otherwise noted ) wavelength (nm) relative response 0 300 600 400 500 700 800 0.6 0.2 0.4 0.8 1.2 1.0 fig.1 white led spectrum vs. wavelength applied voltage (v) forward current if(ma) 2.8 3.0 3.2 3.4 3.6 3.8 10 20 30 40 50 20.0 forw ard current (m a ) 10.0 0 2.0 4.0 30.0 0.0 6.0 8.0 10.0 12.0 luminous flux(lm) 40.0 forward current vs. applied voltage forward current vs. luminous intensity ambient temperature ta ( )
0 204060 100 80 forward current if(ma) 10 20 40 30 50 10 0.2 0.8 0.7 0.3 0.5 0.1 0.9 1.0 0 80 70 90 0.4 0.6 40 60 50 30 20 ambient temperature vs. forward current radiation diagram mtp00-w- high power led
MT4P060-WR-A ver.: 01 date: 2009/05/12 page: 4/4 precautions: take note of the following in use of led 1. temperature in use since the light generated inside the led needs to be emitted to outside efficiently, a resin with high light transparency is used; therefore, additives to improve the heat resistance or moisture resistance (silica gel , etc) which are used for semiconductor products such as transistors cannot be added to the resin. consequently, the heat resistant ability of the resin used for led is usually low; therefore, please be careful on the following during use. avoid applying external force, stress, and excessi ve vibration to the resins and terminals at h igh temperature. the glass transition temperature of epoxy resin used for the led is approximately 120-130
. at a temperature exceeding this limit, the co efficient of liner expansion of the resin doubles or more compared to that at normal temperature and the resin is softened. if external force or stress is applied at that time, it may cause a wire rupture. 2. soldering please be careful on the following at soldering. after soldering, avoided applying external force, stress, and excessive vibration until the products go to cooling process (normal temp erature), (1) soldering measurements: distance between melted solder side to bottom of resin shall be 1.6mm or longer. (2) dip soldering: pre-heat: 90
max. (backside of pcb), within 60 seconds. solder bath: 260 ? 5
(solder temperature), within 5 seconds. (3) hand soldering : 350
max. (temperature of solderin g iron tip), within 3 seconds 3. insertion pitch of the led leads and pitch of mounting holes need to be same 4. others since the heat resistant ability of the led re sin is low, smd components are used on the same pcb, please mount the led after adhesive baking process for smd components. in case adhesive baking is done after led lamp insertion due to a production process reason, make s ure not to apply external force, stress, and excessive vibration to the led and follow the con ditions below. ba king temperature: 120
max. bak ing time: within 60 seconds if soldering is done sequentially after the adhesive baking, please perform the soldering after cooling down the led to normal temperature. high power led

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